Energy release rates of bi-material interface crack including residual thermal stresses: Application of crack tip element method
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference24 articles.
1. Aoki T, Ishikawa T, Kumazawa H, Morino Y. Mechanical performance of CF/polymer composite laminates under cryogenic conditions. AIAA Paper 2000-1605.
2. Damage trends in cryogenically cycled carbon/polymer composites;Bechel;Compos Sci Technol,2004
3. Analysis and experiment of gas leakage through cross-ply laminates for propellant tanks;Kumazawa;AIAA J,2003
4. On initiation and growth of debonding between liner and FW layer of cryogenic composite material tank for rocket system due to nonuniform liner thickness;Suemasu;J Japan Soc Compos Mater,2006
5. A test specimen for determining the fracture resistance of bimaterial interfaces;Charalambides;J Appl Mech,1989
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