Micromechanical modeling of damage in periodic composites using strain gradient plasticity
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference30 articles.
1. Influence of fiber architecture on the inelastic response of metal matrix composites;Arnold;Int J Plast,1996
2. Size-effects on yield surfaces for micro reinforced composites;Azizi;Int J Plast,2011
3. Size effects on void growth in single crystals with distributed voids;Borg;Int J Plast,2008
4. A viscoplastic strain gradient analysis of materials with voids or inclusions;Borg;Int J Solids Struct,2006
5. Boyer R, Welsch G, Collings EW. Materials properties handbook: titanium alloys. Materials Park, OH: ASM International; 1994.
Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A BEM multi-scale analysis of concrete plates in bending under static load considering microstructural effects;Engineering Analysis with Boundary Elements;2023-02
2. Micromechanical modeling of damage evolution and fracture behavior in particle reinforced metal matrix composites based on the conventional theory of mechanism-based strain gradient plasticity;Journal of Materials Research and Technology;2023-01
3. Prediction of Elastic Parameters of Particle Reinforced Composites Using Finite Element Simulations;Materials Research;2023
4. Indentation behavior of metal matrix composites reinforced with arbitrary shape particle using a coupled FE-EFG approach;Mechanics of Advanced Materials and Structures;2021-06-03
5. A 2D BEM formulation considering dissipative phenomena and a full coupled multiscale modelling;Engineering Analysis with Boundary Elements;2020-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3