Author:
Pettit R.G.,Wawrzynek P.A.,Carter B.J.,Singh R.,Pilchak A.L.,Rosenberger A.H.,Velez M.,Ward T.W.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference22 articles.
1. Pettit RG. “Crack Growth Threshold Testing with Flat-Bottom Hole Specimens and Artifact Evaluation of Electrothermal Crack Tip Marking”, Engineering Fracture Mechanics vol. 249, no.107737, 2021.
2. Pettit RG. Fracture Marking By a Local Heat Tint Technique, Presentation to ASTM E08 Committee Meeting., Houston, TX, November 4, 2019.
3. Three-Dimensional Characterization of Microstructurally Small Fatigue-Crack Evolution Using Quantitative Fractography Combined with Post-Mortem X-Ray Tomography and High-Energy X-Ray, Diffraction Microscopy;Spear;Acta Mater,2014
4. Pettit RG. System for Thermally Influencing a Crack Tip of Crack Within a Specimen and Related Methods, United States Patent US 11,002,698, US Patent and Trademark Office, 11 May 2021. (additional patent pending).
5. Griffin JH, and Cunningham S. The Influence of Electric Current on Crack Propagation in Thermal Fatigue Tests, Report AFOSR-TR-86-0886 (1986).
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