On the all components of T-stress for an external circular crack under tension and bending
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference40 articles.
1. On the stress distribution at the base of a stationary crack;Williams;J Appl Mech,1957
2. The stress field near the front of an arbitrarily shaped crack in a three-dimensional elastic body;Leblond;J Elast,1992
3. Influence of non-singular stress terms and specimen geometry on small-scale yielding at crack tips in elastic-plastic material;Larsson;J Mech Phys Solids,1973
4. Limitations to the small-scale yielding approximation for crack-tip plasticity;Rice;J Mech Phys Solids,1974
5. Slightly curved or kinked cracks;Cotterell;Int J Fract,1980
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Mode-III external circular crack in an infinite orthotropic medium under torsional loading;International Journal for Computational Methods in Engineering Science and Mechanics;2023-11-27
2. On the T-stress extraction method used by current version of Abaqus;Engineering Fracture Mechanics;2022-12
3. Determination of ductile fracture properties of 16MND5 steels under varying constraint levels using machine learning methods;International Journal of Mechanical Sciences;2022-06
4. Three-Dimensional analysis of mixed mode Compact-Tension-Shear (CTS) Specimens: Stress intensity Factors, T-stresses and crack initiation angles;Theoretical and Applied Fracture Mechanics;2022-04
5. T-stresses solution and out-of-plane constraint for central cracked plate (CCP) with I-II mixed mode crack under uniaxial compression;Theoretical and Applied Fracture Mechanics;2021-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3