Author:
Park Tae-Yong,Shin Seok-Jin,Park Sung-Woo,Kang Soo-Jin,Oh Hyun-Ung
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference30 articles.
1. Modeling the vibration restraints of wedge lock card guides;Barker;Trans ASME J Electronic Packaging,1993
2. McMurray KE. Characterization of boundary conditions for wedge-lock-mounted printed circuit boards. Virginia Polytechnic Institute and State University, Master’s Thesis; 1995.
3. Flannery M, Schmidt J, Weyant J, Thorson K. Thermal enhancements for separable thermal mechanical interfaces. Proceedings of 46th AIAA Thermophysical Conference; 2016, pp. 1–8.
4. Newland S, Watts R. Applications for high thermal conductivity graphite heat sinks for fighter avionics. In: Proceedings of 34th International Conference on Environmental Systems (ICES); 2004, pp. 1–4.
5. R’Guez Corredera M, Lata JM, Sánchez LF. Advanced thermal modeling of space flight electronics equipment. In: Proceedings of 26th International Conference on Environmental Systems (ICES); 1996, pp. 1-10.
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献