1. Alajoki M, Nguyen L, Kivilahti J. Drop test reliability of wafer level chip scale packages. In: Proc. electronic components and technology conference; 2005.
2. Macroscopic measure of the cohesive length scale: fracture of notched single-crystal silicon;Bailey;Phys Rev B,2003
3. The mathematical theory of equilibrium of cracks in brittle fracture;Barenblatt;Adv Appl Mech,1962
4. Bohm C, Hauck T, Juritza A, Müller WH. Weibull statistics of silicon die fracture. In: Proceedings of ETPC; 2004.
5. Bohm C, Hauck T, Müller WH, Juritza A. Probability of silicon fracture in molded packages. In: Proceedings of EuroSimE, Brussels; 2004. p. 75–82.