Copper electroplating technique for development of HTS current leads bottom joints using MgB2 wires-Reference-Cited by-同舟云学术

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Copper electroplating technique for development of HTS current leads bottom joints using MgB2 wires

Published:2022-10 Issue: Volume:601 Page:1354108
ISSN:0921-4534
Container-title:Physica C: Superconductivity and its Applications
language:en
Short-container-title:Physica C: Superconductivity and its Applications

Author:

Bairagi Nitin^ORCID,Sonara D.,Nimavat H.,Tanna V.L.,Prasad U.,Raju D.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference41 articles.

1. Superconductivity: basics & Applications to magnets;Sharma,2015

2. Possible high Tc superconductivity in the Ba-La-Cu-O system;Bednorz;Z. Physik B,1986

3. Aqueous electrochemistry of cuprate-based high Tc superconductors;Rosamilia;J. Electrochem. Soc.,1987

4. Electrodeposition on cuprate-based superconductors in nonaqueous media;Rosamilia;J. Electrochem. Soc,1989

5. Metallic Cu coating on HTS surfaces using electrochemical preparation;Floegel-Delor;IEEE Trans. Appl. Supercond.,2001

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Feasibility Study of HTS Current Leads With MgB₂ Shunt for Tokamak Application;IEEE Transactions on Applied Superconductivity;2024-08

2. Test Results of a Prototype HTS Current Lead With MgB₂ and NbTi Superconducting Joints;IEEE Transactions on Applied Superconductivity;2023-06

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