Dynamic stress intensity factors of mode-I crack in high temperature superconductor
Author:
Publisher
Elsevier BV
Subject
Electrical and Electronic Engineering,Energy Engineering and Power Technology,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. Direct measurements of mechanical properties for large-grain bulk superconductors
2. Effect of resin layer on the thermal stress of bulk superconductors
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4. Crack–inclusion problem for a long rectangular slab of superconductor under an electromagnetic force
5. The interaction of two collinear cracks in a rectangular superconductor slab under an electromagnetic force
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1. Numerical simulation of dynamic fracture behavior in bulk superconductors with an electromagnetic-thermal model;Superconductor Science and Technology;2019-05-21
2. Effects of interfacial discontinuity on the fracture behavior in the superconductor-substrate system;Theoretical and Applied Mechanics Letters;2019-01
3. The Strain Energy Release Rate for Stack of Coated Conductors with Interface Crack in Perpendicular Magnetic Field;Fracture Mechanics - Properties, Patterns and Behaviours;2016-10-19
4. Dynamic fracture behavior of a crack in the bulk superconductor under electromagnetic force;Engineering Fracture Mechanics;2016-06
5. Fracture problem of a nonhomogeneous high temperature superconductor slab based on real fundamental solutions;Physica C: Superconductivity and its Applications;2015-12
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