Adhesion strength study of IBAD–MOCVD-based 2G HTS wire using a peel test-Reference-Cited by-同舟云学术

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Adhesion strength study of IBAD–MOCVD-based 2G HTS wire using a peel test

Published:2012-02 Issue: Volume:473 Page:41-47
ISSN:0921-4534
Container-title:Physica C: Superconductivity
language:en
Short-container-title:Physica C: Superconductivity

Author:

Zhang Y.,Hazelton D.W.,Knoll A.R.,Duval J.M.,Brownsey P.,Repnoy S.,Soloveichik S.,Sundaram A.,McClure R.B.,Majkic G.,Selvamanickam V.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Thermal Stability of Conduction-Cooled YBCO Pancake Coil

2. Degradation of the performance of a YBCO-coated conductor double pancake coil due to epoxy impregnation

3. M.P. Oomen, W. Herkert, D. Bayer, W. Nick, T. Arndt, EUCAS presentation, 2-LB-I1, The Hague, The Netherlands, 2011.

4. Adhesion Measurement of Thin Films

5. Measurement of thin film adhesion

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