Joining of Bi-2212 high-Tc superconductors and metals using indium solders-Reference-Cited by-同舟云学术

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Joining of Bi-2212 high-Tc superconductors and metals using indium solders

Published:2007-10 Issue: Volume:463-465 Page:464-467
ISSN:0921-4534
Container-title:Physica C: Superconductivity and its Applications
language:en
Short-container-title:Physica C: Superconductivity and its Applications

Author:

Oh S.Y.,Kim H.R.,Jeong Y.H.,Hyun O.B.,Kim C.J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference4 articles.

1. Manufacturing and testing of MCP 2212 bifilar coils for a 10 MVA fault current limiter

2. Qualification of MCP BSCCO 2212 bulk material for use in resistive current limiters

3. Interfacial reactions and growth kinetics for intermetallic compound layer between In–48Sn solder and bare Cu substrate

4. Intermetallic compound layer formation between Au and In-48Sn solder

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1. Evolution of residual compressive stress regions in Co-diffused Bi-2212 engineering ceramics with annealing temperature;Journal of Materials Science: Materials in Electronics;2024-09

2. Reveal of relationship between microscopy architecture and mechanical performance of Y/Bi substituted Bi‐2212 engineering ceramics;Microscopy Research and Technique;2024-08-29

3. Support of polaronic states and charge carrier concentrations of YBa₂Cu₃O₇_‐y ceramics by oxygen and Mn₂O₃ impurity;Microscopy Research and Technique;2024-01-19

4. Development of modulation, pairing mechanism, and slip system with optimum vanadium substitution at Bi-sites in Bi-2212 ceramic structure;Materials Chemistry and Physics;2023-10

5. Evolution of electrical, superconducting, crystallinity and structural features with aliovalent Nd/Sr replacement in Bi-2223 ceramics;Materials Chemistry and Physics;2022-09

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