Author:
Li Yaqiang,Ma Xiaochuan,Li Ruopeng,Zhang Jinqiu,Yang Peixia,Liu Anmin,Wang Bo,Broekmann Peter,An Maozhong
Funder
National Natural Science Foundation of China
Harbin Institute of Technology
State Key Laboratory of Urban Water Resource and Environment
Subject
Electrochemistry,General Chemical Engineering,Analytical Chemistry
Reference46 articles.
1. L. Yaqiang, M. Xiaochuan, Z. Jinqiu, et al. Research Progress of Metal Interconnection Technology and Related Theory in Chip Fabrication [J]. Surface technology, 2021, 50 (7): 24-43, 164.
2. Influences of suppressing additive malachite green on superconformal cobalt filling and nucleation [J];Ma;Journal of Electrochemistry,2022
3. Potential of ruthenium and cobalt as next-generation semiconductor interconnects [J];Choi;Korean Journal of Metals and Materials,2018
4. Spin-dependent electron scattering in cobalt interconnects [J];Lanzillo;J. Phys. D Appl. Phys.,2019
5. Mechanism of Co liner as enhancement layer for Cu interconnect gap-fill [J];He;J. Electrochem. Soc.,2013
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