Cu nanofilm formation by electrochemical atomic layer deposition (ALD) in the presence of chloride ions
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering,Analytical Chemistry
Reference40 articles.
1. Platinum Nanofilm Formation by EC-ALE via Redox Replacement of UPD Copper: Studies Using in-Situ Scanning Tunneling Microscopy
2. Copper Nanofilm Formation by Electrochemical Atomic Layer Deposition
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4. The thermodynamics of electrochemical annealing
5. Adsorption of gaseous and aqueous hydrochloric acid on the low-index planes of copper
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