1. Balzani, C., Wagner, W., Wilckens, D., Degenhardt., R., Busing., S., Reimerdes., H.-G., Adhesive joints in composite laminates—A combined numerical experimental estimate of critical energy release rates, International Journal of Adhesion & Adhesives 32(2012),23-38.
2. Ben Fekih, L., Verlinden, O., De Fruytier, Ch., Kouroussis, G., Novel stress-based criterion for the design of adhesive-bonded space electronics, Proceedings of the 4th European Conference on Spacecraft Structures, Materials and Environmental Testing (ECSSMET), Toulouse, France (2016a).
3. Ben Fekih, L., Verlinden, O., De Fruytier, Ch., Kouroussis, G., On the non-linear dynamic properties of Trabond 8.2 structural adhesive. Proceedings of the 23rd International Congress on Sound and Vibration (ICSV23), Athens, Greece, (2016b).
4. Ben Fekih, L., Kouroussis G., Verlinden O., Verification of empirical warp-based design criteria of space electronic boards, Microelectronics Reliability, 55, 12B, 2786-2792 (2015a).
5. Ben Fekih, L., Kouroussis, G., De Fruytier, Ch., Verlinden, O., Robustness evaluation of adhesively bonded ceramic quad flat chips for space applications, Vibration Engineering and Technology of Machinery, Springer International Publishing, (2015b) 547-557.