Identification and compensation of error sources in the microbond test utilising a reliable high-throughput device-Reference-Cited by-同舟云学术

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Identification and compensation of error sources in the microbond test utilising a reliable high-throughput device

Published:2020-10 Issue: Volume:137 Page:105988
ISSN:1359-835X
Container-title:Composites Part A: Applied Science and Manufacturing
language:en
Short-container-title:Composites Part A: Applied Science and Manufacturing

Author:

Laurikainen P.,Kakkonen M.,von Essen M.,Tanhuanpää O.,Kallio P.,Sarlin E.

Funder

Tampere University Graduate School

Publisher

Elsevier BV

Subject

Mechanics of Materials,Ceramics and Composites

Reference29 articles.

1. Influence of sizing formulations on glass/epoxy interphase properties;Dey;Compos Part A: Appl Sci Manuf,2014

2. A review of analytical models to describe pull-out behavior – fiber/matrix adhesion;Teklal;Compos Struct,2018

3. A microbond method for determination of the shear strength of a fiber/resin interface;Miller;Compos Sci Technol,1987

4. A new approach to surface energy characterization for adhesive performance prediction;Penn;Surf Interface Anal,1981

5. Pitkethly M, Favre J, Gaur U, Jakubowski J, Mudrich S, Caldwell D, et al. A round-robin programme on interfacial test methods, Compos Sci Technol 1993;48:205–14. doi: 10.1016/0266-3538(93)90138-7, Special Issue Microphenomena in Advanced Composites.

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