Three-dimensional reconstruction of resin flow using capacitance sensor data assimilation during a liquid composite molding process: A numerical study
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,Ceramics and Composites
Reference32 articles.
1. Modelling and simulation of resin transfer moulding (RTM) – gate control, venting and dry spot prediction;Liu;Compos Part A Appl Sci Manuf,1996
2. A process performance index based on gate-distance and incubation time for the optimization of gate locations in liquid composite molding processes;Sánchez;Compos Part A Appl Sci Manuf,2006
3. Advanced numerical simulation of liquid composite molding for process analysis and optimization;Trochu;Compos Part A Appl Sci Manuf,2006
4. Simultaneous gate and vent location optimization in liquid composite molding processes;Gokce;Compos Part A Appl Sci Manuf,2004
5. Statistical modeling of in-plane permeability of non-woven random fibrous reinforcement;Zhang;Compos Sci Technol,2012
Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Improved genetic algorithm for 2D resin flow model optimization in VARTM process;Modelling and Simulation in Materials Science and Engineering;2023-10-19
2. Monitoring techniques to measure the rapid curing of polymer composites;Rapid Cure Composites;2023
3. Monitoring of three-dimensional resin flow front using hybrid piezoelectric-fiber sensor network in a liquid composite molding process;Composites Science and Technology;2022-10
4. Life-cycle health monitoring of composite structures using piezoelectric sensor network;Smart Materials and Structures;2021-12-07
5. Sequential estimation of the generated curing heat of composite materials by data assimilation: A numerical study;Heliyon;2020-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3