A review on the Representative Volume Element-based multi-scale simulation of 3D woven high performance thermoset composites manufactured using resin transfer molding process
Author:
Funder
Natural Sciences and Engineering Research Council of Canada
Groupe SAFRAN
Publisher
Elsevier BV
Subject
Mechanics of Materials,Ceramics and Composites
Reference170 articles.
1. GE Aviation.
2. Modelling and simulation of resin transfer moulding (RTM) - Gate control, venting and dry spot prediction;Liu;Composites A,1996
3. Numerical analysis of cure temperature and internal stresses in thin and thick RTM parts;Ruiz;Composites A,2005
4. Numerical analysis of viscoelastic process-induced residual distortions during manufacturing and post-curing;Benavente;Composites A,2018
5. Advances in composites manufacturing and process design;Boisse,2015
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A parametric modeling method for 2.5D warp-reinforced woven composites considering the extruded distortion of yarns;Composites Science and Technology;2024-10
2. A scale-span method to characterize the mechanical property of BCF/PEEK considering uncertain structural characteristics;Thin-Walled Structures;2024-10
3. Towards accurate prediction of the dynamic behavior and failure mechanisms of three-dimensional braided composites: A multiscale analysis scheme;Thin-Walled Structures;2024-10
4. Deep learning and integrated approach to reconstruct meshes from tomograms of 3D braided composites;Composites Science and Technology;2024-08
5. An efficient viscoelastic multiscale model for investigation on the cure‐induced microscopic residual stresses of composite laminates;Polymer Composites;2024-05-16
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3