Method for in situ analysis of volatiles generated during cure of composites
Author:
Funder
M.C. Gill Composites Center
Publisher
Elsevier BV
Subject
Mechanics of Materials,Ceramics and Composites
Reference24 articles.
1. Void formation in composite prepregs – Effect of dissolved moisture;Grünenfelder;Compos Sci Technol,2010
2. Effects of variation in autoclave pressure, temperature, and vacuum-application time on porosity and mechanical properties of a carbon fiber/epoxy composite;Koushyar;J Compos Mater,2012
3. Formation of voids in composite laminates: coupled effect of moisture content and processing pressure;Anderson;Polym Compos,2015
4. Processing and properties of IM7/PETI composites;Hou;J Compos Mater,1996
5. The effect of process parameters on volatile release for a benzoxazine–epoxy RTM resin;Lo;Compos Part A Appl Sci Manuf,2016
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2. Surface porosity development in tool-side facesheets of honeycomb core sandwich structures during co-cure;Advanced Manufacturing: Polymer & Composites Science;2022-04-03
3. Strength degradation and fractographic analysis of carbon fiber reinforced polymer composite laminates with square / circular hole using scanning electron microscope micrographs;Journal of Applied Polymer Science;2020-11-02
4. Path-dependent bond-line evolution in equilibrated core honeycomb sandwich structures;Advanced Manufacturing: Polymer & Composites Science;2020-07-02
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