A new interface bonding improvement method combined with precipitation and hot-pressing process to ameliorate the defects of para aramid paper-Reference-Cited by-同舟云学术

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A new interface bonding improvement method combined with precipitation and hot-pressing process to ameliorate the defects of para aramid paper

Published:2024-05 Issue: Volume:180 Page:108052
ISSN:1359-835X
Container-title:Composites Part A: Applied Science and Manufacturing
language:en
Short-container-title:Composites Part A: Applied Science and Manufacturing

Author:

Xie Ping,Li Na,Zhao Kairong,Cao Yutong,Yu Junrong,Wang Yan,Hu Zuming^ORCID

Funder

Ministry of Science and Technology of the People's Republic of China

National Key Research and Development Program of China

Publisher

Elsevier BV

Reference37 articles.

1. Aramid nanofibers and poly (vinyl alcohol) nanocomposites for ideal combination of strength and toughness via hydrogen bonding interactions;Guan;Compos Sci and Technol,2017

2. Preparation of composite insulating paper with decreased permittivity, good mechanical and thermal properties by kevlar/nano cellulose fibrils/softwood pulp hybrid;Mo;IEEE Access,2019

3. Graphene-aramid nanofiber nanocomposite paper with high mechanical and electrical performance;Fan;RSC Adv,2013

4. Shear property characterization of aramid paper and its application to the prediction of honeycomb behaviors;Yang;Compos Struct,2020

5. Influence of hot-pressing temperature on the formation of aramid paper;Yao;Therm Sci,2018

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