Flexural and compression response of woven E-glass/polyester–CNF nanophased composites

Author:

Hossain M.K.,Hossain M.E.,Hosur M.V.,Jeelani S.

Publisher

Elsevier BV

Subject

Mechanics of Materials,Ceramics and Composites

Reference45 articles.

1. The rise of composites in the automotive market;Millerschin;Compos Fabr,1999

2. Clay-polymer nanocomposites formed from acidic derivatives of montmorillonite and an epoxy resin;Wang;Chem Mater,1994

3. Clay-reinforced epoxy nanocomposites;Lan;Chem Mater,1994

4. Polymer-clay nanocomposites;Wang,2001

5. New type of non-crystalline solids between inorganic and organic materials;Schmidt;J Non-Crystal Solids,1985

Cited by 49 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Hybrid synthetic fibers: composites and automotive applications;Synthetic and Mineral Fibers, Their Composites and Applications;2024

2. The role of fillers to enhance the mechanical, thermal, and wear characteristics of polymer composite materials: A review;Composites Part A: Applied Science and Manufacturing;2023-12

3. Glass Fiber-Epoxy Composites with Carbon Nanotube Fillers for Enhancing Properties in Structure Modeling and Analysis Using Artificial Intelligence Technique;ACS Omega;2023-06-21

4. Effects of Dispersion of Graphene Nanoplatelets on the Improvement of Thermal Properties and Morphology of Polymer Nano-Composites;2023 International Conference on Science, Engineering and Business for Sustainable Development Goals (SEB-SDG);2023-04-05

5. Effects of graphene nanoplatelets dispersion on the morphology of polymer nano-composites;TECHNOLOGIES AND MATERIALS FOR RENEWABLE ENERGY, ENVIRONMENT AND SUSTAINABILITY: TMREES22Fr;2023

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3