Thermal stress distributions and optimization on stress reductions with or/and without linearly graded interlayers

Author:

Wang Binglian,Li Yizeng,Huo Yongzhong

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Reference21 articles.

1. Stress related problems in silicon technology;Hu;J Appl Phys,1991

2. The tesion of metallic films deposited by electrolysis;Stoney;Proc Phys Soc Lond,1909

3. Analysis of bi-metal thermostats;Timoshenko;J Opt Soc Am,1925

4. Calculation of stress in electrodeposits from the curvature of a plated strip;Brenner;J Res Natl Bur Stand,1949

5. Measurement of residual stresses in electrolytic deposites;Davidenkov;Sov Phys – Solid State,1961

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