Enhanced thermal conductivity of polymer composites via hybrid fillers of anisotropic aluminum nitride whiskers and isotropic spheres-Reference-Cited by-同舟云学术

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Enhanced thermal conductivity of polymer composites via hybrid fillers of anisotropic aluminum nitride whiskers and isotropic spheres

Published:2017-04 Issue: Volume:114 Page:237-246
ISSN:1359-8368
Container-title:Composites Part B: Engineering
language:en
Short-container-title:Composites Part B: Engineering

Author:

Dang Thi My Linh,Kim Chang-Yeoul,Zhang Yaming,Yang Jian-Feng,Masaki Takaki,Yoon Dae-Ho^ORCID

Funder

Korean Ministry of Industry, Energy, and Commerce

Industrial Core Material development program

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Reference29 articles.

1. Thermal challenges in next-generation electronic systems;Garimella;IEEE Trans Compon Pack,2008

2. Thermal interface materials: historical perspective, status, and future directions;Prasher;Proc IEEE,2006

3. Thermal investigation and placement design of high-brightness LED array package on PCB for uniform illuminance;Yung;J Electron Packag,2011

4. Heat dissipation performance of high brightness LED package assembly using high-thermal conductivity filler;Yung;Appl Opt,2013

5. A review of dielectric polymer composites with high thermal conductivity;Huang;IEEE Electr Insul M,2011

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