Synergetic effect of thermal conductive properties of epoxy composites containing functionalized multi-walled carbon nanotubes and aluminum nitride

Author:

Teng Chih-Chun,Ma Chen-Chi M.,Chiou Kuo-Chan,Lee Tzong-Ming

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Reference20 articles.

1. Thermal conductivity of polymer composites with close-packed structure of nano and micro fillers;Sanada;Compos Part A – Appl,2009

2. Thermal characterization of Al2O3 and ZnO reinforced silicone rubber as thermal pads for heat dissipation purposes;Sim;Thermo Acta,2005

3. Howard KE. Epoxy polymer filled with aluminum nitride-containing polymer and semiconductor devices encapsulated with a thermosetting resin containing aluminum nitride particles. US patent 5589714; 1996.

4. Thermally conducting aluminum nitride polymer–matrix composites;Xu;Compos Part A – Appl,2001

5. Thermal conductivity of polystyrene–aluminum nitride composite;Yu;Compos Part A – Appl,2002

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