Improvement of silicon and epoxy phase interface by constructing rigid interpenetrating networks based on bismaleimide to enhance ablative, mechanical and thermal properties
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Published:2024-09
Issue:
Volume:284
Page:111675
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ISSN:1359-8368
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Container-title:Composites Part B: Engineering
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language:en
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Short-container-title:Composites Part B: Engineering
Author:
Ling Youquan,
Qiu Baowei,
Lei Xue,
Shen Lu,
Jin Hui,
Zhang Xi,
Liang Mei,
Chen YangORCID,
Zou Huawei
Funder
Sichuan University
Cited by
1 articles.
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