Some technological properties of wood–styrofoam composite panels

Author:

Demirkir Cenk,Colak Semra,Aydin Ismail

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Reference22 articles.

1. Geometric model for softwood transverse thermal conductivity. Part I;Gu;Wood Fiber Sci,2005

2. Some of the coefficients of thermal conductivity of wood and wood-based materials;Örs;Turk J Agric For,1999

3. Thermal analysis of wood-based test cells;Krüger;Constr Build Mater,2010

4. Manufacture of strand board bonded with disposal expanded polystyrene as binder;Hermawan;J Fac Agr Kyushu Univ,2010

5. Development of new natural polymer-based wood adhesives I: dry bond strength and water resistance of konjac glucomannan, chitosan, and their composites;Umemura;J Wood Sci,2003

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