A hybrid experimental and numerical technique for evaluating residual strains/stresses in bonded lap joints
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference65 articles.
1. Processing of fibre reinforced thermoplastic composites;Vaidya;Int Mater Rev,2008
2. 5-Thermoplastics and thermoplastic–matrix composites for lightweight automotive structures;Mallick,2010
3. Thermal residual stresses in an adhesively bonded functionally graded tubular single lap joint;Apalak;Int J Adhesion Adhes,2007
4. Residual stresses in thermoplastic composites—a study of the literature—Part I: formation of residual stresses;Parlevliet;Compos Appl Sci Manuf,2006
5. Thermal residual stress in metal matrix composite;Arsenault;Acta Metall,1987
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Semi-destructive methods for evaluating the micro-scale residual stresses of carbon fiber reinforced polymers;Composites Part B: Engineering;2024-09
2. Optimisation of process-induced residual stresses in composite laminates by different genetic algorithm and finite element simulation coupling methods;Journal of Composite Materials;2024-07-30
3. Substrate Thickness Optimization in Multi-Material Single Lap Adhesive Joints;Journal of Applied Mechanics;2024-01-29
4. Comparative analysis of thermoplastic and thermoset adhesives performance and the influence on failure analysis in jointed elium‐based composite structures;Polymer Composites;2023-12-08
5. Process optimization for short carbon fiber polyetherimide composite mold;Journal of Reinforced Plastics and Composites;2023-08-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3