Author:
Wu Zhiqiang,Dong Jie,Li Xiuting,Zhao Xin,Ji Chengchang,Zhang Qinghua
Funder
National Natural Science Foundation of China
National Key Research and Development Program of China
Natural Science Foundation of Shanghai Municipality
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference55 articles.
1. Emerging challenges and materials for thermal management of electronics;Moore;Mater Today,2014
2. Thermal conductivity of 2D nano-structured boron nitride (BN) and its composites with polymers;Guerra;Prog Mater Sci,2019
3. Rational design of two-dimensional nanofillers for polymer nanocomposites toward multifunctional applications;Shen;Prog Mater Sci,2021
4. Advances on thermally conductive epoxy-based composites as electronic packaging underfill materials-A review;Wen;Adv Mater,2022
5. Thermal transport in 2D semiconductors-considerations for device applications;Zhao;Adv Funct Mater,2020
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