Author:
Hu Jingxian,Yin Fucheng,Wang Xinming,Ouyang Xuemei
Funder
National Science Foundation of the China
the Scientific Research Fund of Hunan Provincial Educational Department
Subject
Computer Science Applications,General Chemical Engineering,General Chemistry
Reference24 articles.
1. Lead-free solders in microelectronics;Abtew;Mater. Sci. Eng. R,2000
2. Advances in lead-free electronics soldering;Suganuma;Curr. Opin. Solid State Mater. Sci.,2001
3. Sn–Zn low temperature solder;Suganuma;J. Mater. Sci. Mater. Electron.,2007
4. Proceedings of the Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing;Tadauchi,2001
5. Effect of small additions of alloying elements on the properties of Sn–Zn eutectic alloy;Chen;J. Electron. Mater.,2006
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献