Author:
Bertoldi Dalía S.,Ramos Susana B.,Fernández Guillermet A.
Funder
Consejo Nacional de Investigaciones Científicas y Técnicas
Universidad Nacional del Comahue
Subject
Computer Science Applications,General Chemical Engineering,General Chemistry
Reference34 articles.
1. Microstructure and creep of eutectic indium/tin on copper and nickel substrates;Freer;J. Electron. Mater.,1992
2. A review: on the development of low melting temperature Pb-free solders;Kotadia;Microelectron. Reliab.,2014
3. Ab initio study of the cohesive properties, electronic structure and thermodynamic stability of the Ni-In and Ni-Sn intermetallics;Ramos de Debiaggi;J. Alloys Compd.,2013
4. Thermodynamic properties of lead free soldering intermetallics: database, electron-density correlations and interpretation of bonding trends in (Cu,Ni)-(In,Sn) alloys;Ramos;J. Phys. Chem. Solid.,2016
5. Cohesive properties of Cu-X and Ni-X (In,Sn) intermetallics: Ab initio systematics, correlations and ‘‘Universality’’ features;Bertoldi;J. Phase Equilibria Diffus.,2017
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