Synthesis and structural analysis of intermetallic compounds in electrical connections

Author:

Willing Heidi,Richter Andreas,Kappl Herbert,Freudenberger Renate,Oberst Marcella,Schlegel Stephan,Pfeifer Stephanie

Funder

Arbeitsgemeinschaft industrieller Forschungsvereinigungen Otto von Guericke e V

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry

Reference32 articles.

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3. Investigation of interfacial reactions in thin film couples of aluminium and copper by measurement of low temperature contact resistance;Rayne;Thin Solid Films,1980

4. Low temperature resistivity of thin film and bulk samples of CuAl2 and Cu9Al4;Maccioni;Thin Solid Films,1981

5. Diffusion in galvanisch aufgebrachten Schichten und Weichloten bei Temperaturen zwischen 23 und 212°C;Creydt,1971

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