Structural anomaly in the high-entropy alloy ZrNbTiTaHf
Author:
Funder
European Research Council
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference34 articles.
1. Nanostructured high-entropy alloys with multiple principal elements: novel alloy design concepts and outcomes;Yeh;Adv. Eng. Mater.,2004
2. Microstructural development in equiatomic multicomponent alloys;Cantor;Mater. Sci. Eng. A,2004
3. Hexagonal high-entropy alloys;Feuerbacher;Mater. Res. Lett.,2015
4. High-entropy alloys with a hexagonal close-packed structure designed by equi-atomic alloy strategy and binary phase diagrams;Takeuchi;JOM,2014
5. Mechanical performance of the AlxCoCrCuFeNi high-entropy alloy system with multiprincipal elements;Tong;Metall. Mater. Trans. A,2005
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