Investigation of microstructure evolution and mechanical properties of near-eutectic Fe2-CoNiCr C high entropy cast iron-Reference-Cited by-同舟云学术

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Investigation of microstructure evolution and mechanical properties of near-eutectic Fe2-CoNiCr C high entropy cast iron

Published:2023-03 Issue: Volume:154 Page:107805
ISSN:0966-9795
Container-title:Intermetallics
language:en
Short-container-title:Intermetallics

Author:

Wang Yeqing,Chen Xuan,Shi Xiao,Xu Zhe,Fan Yu,Wang Liang,Chen Zheng

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry

Reference32 articles.

1. A promising new class of high-temperature alloys: eutectic high-entropy alloys;Lu;Sci. Rep.,2014

2. Eutectic/eutectoid multi-principle component alloys: a review;Baker;Mater. Char.,2019

3. Designing eutectic high entropy alloys of CoCrFeNiNbx;He;J. Alloys Compd.,2016

4. A casting eutectic high entropy alloy with superior strength-ductility combination;Wu;Mater. Lett.,2019

5. Directly cast bulk eutectic and near-eutectic high entropy alloys with balanced strength and ductility in a wide temperature range;Lu;Acta Mater.,2017

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of C content on microstructure evolution and mechanical properties of CoCrFeNiTa0.1 high entropy alloy;Journal of Alloys and Compounds;2024-10

2. Improving wear and corrosion resistance of U71Mn rail steel subjected to laser in-situ fabrication of Fe based Cr–V coatings;Wear;2024-06

3. Microstructure refinement mechanism upon deeply undercooled solidification of a Ni88Cu6Co6 alloy;Journal of Materials Research and Technology;2024-01

4. Influence of interstitial carbon content on the microstructure, mechanical and electrochemical corrosion properties of CoFeNiMn multi-principal component alloys;Journal of Materials Research and Technology;2023-11

5. Co effect on rapid solidification microstructure transition of highly undercooled copper alloys;Journal of Materials Research and Technology;2023-07

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