Application of a genetic algorithm to the optimal design of the die shape in extrusion
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference19 articles.
1. O. Richmond, M.L. Davenpeck, A die profile for maximum efficiency in strip drawing, 4th US Cong. Appl. Mech., ASME (1962) 1053.
2. Lubricated extrusion of `T' sections from aluminum, titanium and steel using computer-aided techniques;Nagpal;J. Eng. Ind.,1979
3. Analysis of hydrofilm extrusion through optimized curved dies;Cho;Int. J. Mech. Sci.,1982
4. A generalized method for analysis of three-dimensional extrusion of arbitrarily-shaped sections
5. A new formulation for three-dimensional extrusion and its application to extrusion of clover sections
Cited by 51 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Discovery of New Heteroaryldihydropyrimidine Compounds as HBV Capsid Protein Inhibitors Based on QSAR, Molecular Docking and Molecular Dynamics Simulations**;ChemistrySelect;2024-07-29
2. Optimizations of extrusion semidie angle and fabrication of extrusion die;AIP Conference Proceedings;2020
3. Optimized Design for a Combined Die with Two Stress Rings in Cold Forging Considering Thermal-Mechanical Effects;Journal of Shanghai Jiaotong University (Science);2019-12-09
4. A Comprehensive Study on Fitness Approximation Techniques in Shape Optimization of Aerofoil Forging Preform Tools;Metals;2019-05-28
5. Shape optimization of preform tools in forging of aerofoil using a metamodel-assisted multi-island genetic algorithm;Journal of the Chinese Institute of Engineers;2019-04-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3