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Conventional metallic bonding and three-dimensional crystallizing π-bondings

  • Published:1997-09 Issue:1-3 Volume:69 Page:134-147
  • ISSN:0924-0136
  • Container-title:Journal of Materials Processing Technology
  • language:en
  • Short-container-title:Journal of Materials Processing Technology

Author:

Oh Hung-kuk

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference11 articles.

1. Foundations of Materials Science and Engineering;Smith,1993

2. A note on new metallic bonding orbital;Oh,1995

3. Elastic anisotropic channelling and localized superconductive orbitel in metal at room temperature;Oh,1995

4. Laws of electromagnetics and three-dimensional crystallizing combined π-bonding orbitals;Oh,1995

5. Three-dimensional Crystallizing Combined π-bonding Orbitals and Computer Aided Material Testing System;Oh,1995

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interfacial bonding and microstructural evolution of Al in kinetic spraying;Journal of Materials Science;2012-02-24

2. Heat generation from friction and metal forming;Journal of Materials Processing Technology;2002-02

3. A note on the inadequacy of dislocation theory (disbonding theory);Journal of Materials Processing Technology;2000-08

4. Physics of plasticity;Journal of Materials Processing Technology;2000-01

5. The influence of atmospheric humidity on the friction and wear of carbon steels;Journal of Materials Processing Technology;1999-10
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