Electrical and thermal properties of the interface at diffusion-bonded and soldered 304 stainless steel and copper bimetal-Reference-Cited by-同舟云学术

Electrical and thermal properties of the interface at diffusion-bonded and soldered 304 stainless steel and copper bimetal

Published:2003-10 Issue:1 Volume:141 Page:67-76
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Yilmaz O,Çelik H

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference26 articles.

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4. S. Fukumoto, A. Hirose, K. Kobayashi, Diffusion bonding of SIC/Ti–6Al–4V composite to Ti–6Al–4V alloy and fracture, Micro joining for electronics, Prod. Eng. 46 (1989).

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