Logistics from IMS towards virtual factory-Reference-Cited by-同舟云学术

Logistics from IMS towards virtual factory

Published:2000-06 Issue:1 Volume:103 Page:6-13
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Cser L,Cselényi J,Geiger M,Mäntylä M,Korhonen A.S

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference6 articles.

1. K.-H. Wehking, Materialflußtechnik und Logistik im Wandel, 15. Dortmunder Gespräche, 1997, pp. 1.18–1.22.

2. A. Kuhn, Fabrikorganisation und Logistik, 15. Dortmunder Gespräche, 1997, pp. 1.41–1.52.

3. H. Wildemann, Logistik Proceßmanagement, TCW Transfer-Centrum, München, 1997.

4. R. Jünemann, Die zukünftige Rolle des Förder- und Lagerwesens in Forschung und Entwicklung-eine Standortbestimmung, 15. Dortmunder Gespräche, 1997, pp. 1.53–1.73.

5. J.X. Gao, W.H. Ip, A systematic analysis and re-design of the logistics of a world-wide manufacturing network, CIRP International Symposium Advanced Manufacture in the Global Manufacturing Era, Hong-Kong, 21–22 August 1997, pp. 448–454.

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mathematical modeling of multiple tour multiple traveling salesman problem using evolutionary programming;Applied Mathematical Modelling;2015-06

2. A framework for development of an intelligent system for design and manufacturing of stamping dies;IOP Conference Series: Materials Science and Engineering;2014-07-22

3. Business and logistics hub integration to facilitate global supply chain linkage;Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture;2007-07-01

4. Hash-Based RFID Security Protocol Using Randomly Key-Changed Identification Procedure;Computational Science and Its Applications - ICCSA 2006;2006

5. Simulation Diagnosis for the Bottleneck of Production Lines and Its Application;Materials Science Forum;2004-12