Effect of reverse pulse current on the internal stress of electroformed nickel-Reference-Cited by-同舟云学术

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Effect of reverse pulse current on the internal stress of electroformed nickel

Published:1997-01 Issue:1-3 Volume:63 Page:819-822
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Chan K.C.,Qu N.S.,Zhu D.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference4 articles.

1. Theory and Practice of Reverse pulse current Electroplating;Xiang,1989

2. Theory and Research Methods of Metal Deposit;Zhou,1987

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Tuning residual stress in electrodeposited nickel films via pulse current;Surfaces and Interfaces;2023-08

2. Production of the electroplated nano composites Ni-SiC by PRP and anionic surfactant;AIP Conference Proceedings;2023

3. Influence of pulse reverse current parameters on electrodeposition of copper-graphene nanocomposite coating;Applied Surface Science Advances;2021-09

4. Electrochemical tailoring of Pb-free Sn coatings modified with SiC nanoparticles by surfactant-assisted reverse pulse plating;Applied Surface Science;2021-06

5. Evaluation of residual stress of metal micro structure electroformed with megasonic agitation;Journal of Manufacturing Processes;2020-11

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