Ductile cutting of tungsten carbide
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites
Reference15 articles.
1. The strength properties and frictional behavior of brittle solids;King;Proc. Roy. Soc. London A,1954
2. Chip topography for ductile-regime machining of germanium;Blackley;ASME J. Eng. Ind.,1994
3. Ductile-regime grinding: a new technology for machining brittle materials;Bifano;ASME J. Eng. Ind.,1991
4. Observations on polishing and ultraprecision machining of semiconductor substrate materials;Venkatesh;Ann. CIRP,1995
5. Diamond cutting of silicon with nanometric finish;Fang;Ann. CIRP,1998
Cited by 104 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of Friction on Critical Cutting Depth for Ductile–Brittle Transition in Material Removal Mechanism;Journal of Tribology;2024-08-05
2. Enhancing ductile regime ultra-precision diamond turning of curved zinc selenide (ZnSe) optics by using straight-nosed diamond tools with cutting-edge-slipping;Journal of Manufacturing Processes;2024-06
3. Review of ductile machining and ductile-brittle transition characterization mechanisms in precision/ultraprecision turning, milling and grinding of brittle materials;Precision Engineering;2024-06
4. Establishment of a constitutive model for tungsten carbide with different cobalt content and grain size based on the split Hopkinson pressure bar impact test;Journal of Mechanical Science and Technology;2024-04
5. Field-assisted machining of difficult-to-machine materials;International Journal of Extreme Manufacturing;2024-03-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3