Simplified modelling of printed circuit boards for spacecraft applications
Author:
Publisher
Elsevier BV
Subject
Aerospace Engineering
Reference10 articles.
1. Comparison of vibration modeling techniques for printed circuit cards;Pitarresi;ASME Journal of Electronic Packaging,1991
2. The “Smeared” property technique for the FE vibration analysis of printed circuit cards;Pitarresi;ASME Journal of Electronic Packaging,1991
3. Effect of edge and internal point support of a printed circuit board under vibration;Lim;ASME Journal of Electronic Packaging,1999
4. Modeling the vibration restraints of wedge-lock card guides;Barker;ASME Journal of Electronic Packaging,1993
5. Solder joint reliability of fine pitch surface mount technology assemblies;Lau;IEEE Transactions on Components, Hybrids, and Manufacturing Technology,1990
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2. Analyses on the large size PBGA packaging reliability under random vibrations for space applications;Microelectronics Reliability;2020-06
3. Modeling the Elastic Behavior of an Industrial Printed Circuit Board Under Bending and Shear;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-04
4. Application of Steinberg vibration fatigue model for structural verification of space instruments;AIP Conference Proceedings;2018
5. PBGA packaging reliability assessments under random vibrations for space applications;Microelectronics Reliability;2015-01
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