Residual stress brazing process induced in hybrid package for ISP applications-Reference-Cited by-同舟云学术

Residual stress brazing process induced in hybrid package for ISP applications

Published:2010-03 Issue:5-6 Volume:66 Page:897-913
ISSN:0094-5765
Container-title:Acta Astronautica
language:en
Short-container-title:Acta Astronautica

Author:

Monti Riccardo,Coppola Francesco,Gasbarri Paolo,Lecci Umberto

Publisher

Elsevier BV

Subject

Aerospace Engineering

Reference16 articles.

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5. 〈http://www2.dupont.com/MCM/en_US/PDF/designguides/LTCC-20Design-20Guide.pdf〉.

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