Multi-objective topology optimization of passive heat sinks including self-weight based on triply periodic minimal surface lattices
Author:
Funder
Khalifa University of Science, Technology and Research
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Engineering (miscellaneous)
Reference59 articles.
1. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014
2. Heat Transfer: Thermal Management of Electronics;Shabany,2009
3. Additive manufacturing for enhancing thermal dissipation in heat sink implementation: a review;Nafis;Heat Tran. Eng.,2021
4. Convective heat transfer performance of airfoil heat sinks fabricated by selective laser melting;Ho;Int. J. Therm. Sci.,2017
5. Fabrication of heat sinks by Selective Laser Melting for convective heat transfer applications;Wong;Virtual Phys. Prototyp.,2016
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