Effects of silver epoxy reinforcement on graphene nanoplatelets functionalized surface in pool boiling heat transfer enhancement
Author:
Funder
Multimedia University
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Engineering (miscellaneous)
Reference52 articles.
1. Enhanced boiling heat transfer from micro-porous cylindrical surfaces in saturated fc-87 and r-123;Chang;J. Heat Tran.,1997
2. Effect of pressure, subcooling, and dissolved gas on pool boiling heat transfer from microporous, square pin-finned surfaces in fc-72;Rainey;Int. J. Heat Mass Tran.,2003
3. Pool boiling heat transfer and simplified one-dimensional model for prediction on coated porous surfaces with vapor channels;Wu;Int. J. Heat Mass Tran.,2002
4. Enhanced cooling via boiling in porous layers: the effect of vapor channels;Stubos;J. Heat Tran.,1999
5. A parametric study of nucleate boiling on structured surfaces, part i: effect of tunnel dimensions;Chien;J. Heat Tran.,1998
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