Performance optimization of the transient thermoelectric cooling for the temperature control of the chip working under dynamic power
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Published:2024-06
Issue:
Volume:58
Page:104350
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ISSN:2214-157X
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Container-title:Case Studies in Thermal Engineering
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language:en
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Short-container-title:Case Studies in Thermal Engineering
Author:
Wu YongjiaORCID,
Zhang Peng,
Chen Sen,
Zhi Congcong,
Shi Tianhao,
Gong Tingrui,
Ming TingzhenORCID
Cited by
2 articles.
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