An approach for tailoring the interfacial thermal conductance of copper-water nanofluids through ion additions and the underlying mechanism-Reference-Cited by-同舟云学术

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An approach for tailoring the interfacial thermal conductance of copper-water nanofluids through ion additions and the underlying mechanism

Published:2024-09 Issue: Volume:61 Page:104962
ISSN:2214-157X
Container-title:Case Studies in Thermal Engineering
language:en
Short-container-title:Case Studies in Thermal Engineering

Author:

Jin Xiao^ORCID,Shao Chun^ORCID,Huang Lizhong,Wang Ruijin^ORCID

Publisher

Elsevier BV

Reference47 articles.

1. Enhancing thermal conductivity of fluids with nanoparticles;Choi;Asme Fed.,1995

2. Comparison and evaluation of energetic and exergetic performance of an evacuated tube solar collector using various nanofluid;Tong;Process Saf. Environ. Protect.,2023

3. Heat transfer enhancement of Fe3O4-water nanofluid by the thermo-magnetic convection and thermophorestic effect;Du;Int. J. Energ. Res.,2022

4. Heat transfer enhancement of Fe3O4-water nanofluid by the thermo-magnetic convection and thermophorestic effect;Du;Int. J. Energy Res.,2022

5. Investigation on the heat transfer enhancement by nanofluid under electric field considering electrophorestic and thermophoretic effect;Wang;Case Stud. Therm. Eng.,2021

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