Author:
Lam N.Q.,Hoff H.A.,Wiedersich H.,Rehn L.E.
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Cited by
68 articles.
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1. Simulation of the Sputtering Process;Reactive Sputter Deposition;2008
2. Molecular dynamics simulations of the initial stages of sputter erosion of a metal overlayer system: 2keV Ar→Cu/Ni(100);Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2006-01
3. Effects of thermally-activated diffusion on 72keV Ni ion implantation into Cu targets at elevated temperatures;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2005-12
4. A study of high-temperature implantation of 72keV copper ions into nickel;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2005-01
5. Surface composition changes of ternary alloys in the non-steady state regime of preferential sputtering;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2000-04