Study of angular factors in sputter-deposition using the ion beam method
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics
Reference14 articles.
1. Interface Formation during Thin Film Deposition
2. II. The energy spectrum of ejected atoms during the high energy sputtering of gold
3. Sputtering Experiments with 1‐ to 5‐keV Ar+ Ions
4. Velocities of Sputtered Atoms
5. Composition variations as a function of ejection angle in sputtering of alloys
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1. High-Rate Oblique Deposition of SiO2 Films Using Two Sputtering Sources;IEICE Transactions on Electronics;2008-10-01
2. Second wind of the oblique deposition method of liquid-crystal alignment: Ion-beam sputtering technique;Journal of the Society for Information Display;2006
3. Electrical resistivity of RuOx thin films prepared by ion beam sputter deposition;Applied Surface Science;1993-03
4. Energetic carbon deposition at oblique angles;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1992-11
5. Angular, energy, and mass distribution of sputtered particles;Topics in Applied Physics;1991
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