In-depth profile of altered layers of copper-nickel alloys formed by sputtering

Author:

Watanabe Kuniake,Hashiba Masao,Yamashina Toshiro

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Cited by 41 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Surface segregation of AuCu3 by He+ and Au+ irradiation;Acta Physica Sinica;2016

2. Simulation calculations of surface segregation for Au-Cu alloys using an analytic embedded atom model;physica status solidi (a);2005-11

3. Physical sputtering of CuNi alloys: a molecular dynamics study;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1992-09

4. The interaction of O2 with Cu/Ni(100) and Cu/NiO/Ni(100) surfaces studied by XPS;Journal of Electron Spectroscopy and Related Phenomena;1989-01

5. Preferential sputtering in dilute CuNi alloys;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1988-06

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