Crystallographic contributions to grain boundary cracking in an age-hardened copper alloy-Reference-Cited by-同舟云学术

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Crystallographic contributions to grain boundary cracking in an age-hardened copper alloy

Published:2024-07 Issue: Volume:247 Page:116108
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Worsnop Felicity F.^ORCID,Taşan C. Cem

Publisher

Elsevier BV

Reference31 articles.

1. Grain boundary ductile fracture in precipitation hardened aluminum alloys;Vasudévan;Acta Metall.,1987

2. Dry sliding of Cu–15 wt.%Ni–8 wt.%Sn bronze: wear behaviour and microstructures;Singh;Wear,2007

3. Nanoscale characterization of the transfer layer formed during dry sliding of Cu–15 wt.%Ni–8 wt.%Sn bronze alloy;Singh;Acta Mater.,2008

4. Spinodal copper alloy C72900 – new high strength antifriction alloy system;Cribb;Can. Metall. Q.,2011

5. Microstructural effects on tension and fatigue behavior of Cu–15Ni–8Sn sheet;Caris;Mater. Sci. Eng. A,2008

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