Unveiling the interfacial configuration in diamond/Cu composites by using statistical analysis of metallized diamond surface-Reference-Cited by-同舟云学术

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Unveiling the interfacial configuration in diamond/Cu composites by using statistical analysis of metallized diamond surface

Published:2018-07 Issue: Volume:152 Page:84-88
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Zhang Hongdi,Zhang Jingjing,Liu Yue,Zhang Fan,Fan Tongxiang,Zhang Di

Funder

National Key R & D Plan

National Science Fund for Distinguished Young Scholars

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference33 articles.

1. Multigate transistors as the future of classical metal–oxide–semiconductor field-effect transistors

2. Emerging challenges and materials for thermal management of electronics

3. Full-field thermal imaging of quasiballistic crosstalk reduction in nanoscale devices

4. Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications

5. On the thermal conductivity of Cu–Zr/diamond composites

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