Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference14 articles.
1. Microstructure evolution of eutectic Sn-Ag solder joints
2. Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
3. Interfacial reactions and impact reliability of Sn–Zn solder joints on Cu or electroless Au/Ni(P) bond-pads
4. Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad
5. Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu
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1. Growth behavior and kinetics of interfacial IMC for ZnSnCuNiAl/Cu solder joints subjected to isothermal aging;Journal of Materials Science: Materials in Electronics;2024-09
2. Investigation of microstructure, corrosion and mechanical properties of iron and holmium modified Sn-3.0Ag0.5Cu solder alloy with ultrasonic treatment;Materials Characterization;2024-09
3. Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging;Acta Metallurgica Sinica (English Letters);2024-04-15
4. Improved Cu/Sn interface reliability using double-layer stacked nano-twinned Cu;Materials Characterization;2023-11
5. Nucleation and Location of Kirkendall Voids at the Tin‐Based Solder/Copper Joint: A Review;Advanced Engineering Materials;2023-07-26
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