Microstructural stability during cyclic loading of multilayer copper/copper samples with nanoscale twinning-Reference-Cited by-同舟云学术

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Microstructural stability during cyclic loading of multilayer copper/copper samples with nanoscale twinning

Published:2009-06 Issue:12 Volume:60 Page:1073-1077
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Shute C.J.,Myers B.D.,Xie S.,Barbee T.W.,Hodge A.M.,Weertman J.R.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference17 articles.

1. Mechanical behavior of nanocrystalline metals and alloys11The Golden Jubilee Issue—Selected topics in Materials Science and Engineering: Past, Present and Future, edited by S. Suresh

2. Ultrahigh Strength and High Electrical Conductivity in Copper

3. Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures

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2. Use of repeated indenter sliding coupled with finite element computations to investigate the tribological response of nano-twinned 316L stainless steel;Materialia;2023-12

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5. A review on the fatigue cracking of twin boundaries: Crystallographic orientation and stacking fault energy;Progress in Materials Science;2023-01

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